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Reaching simultaneously high mechanical strength and low electrical resistivity is difficult as both properties are based on similar microstructural mechanisms. In our previous work, a new parameter, the tensile strength-over-electrical resistivity ratio, is proposed to evaluate the matching of the two properties in Cu alloys. A specific ratio of 310 × 108 MPa·Ω-1·m-1, independent of the alloy system and thermal history, is obtained from Cu-Ni-Mo alloys, which actually points to the lower limit of prevailing Cu alloys possessing high s
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