https://www.selleckchem.com/pr....oducts/toyocamycin.h
The rapid solidification process of Co50Ni50 alloy was simulated by molecular dynamics method, and the formation and evolution characteristics of cluster structure in the solidification process were analyzed by the pair distribution function, Honeycutt-Andersen bond type index method and the largest standard cluster. The results show that during the solidification process with a cooling rate of 1×1012 K·-1, the probability of mutual bond formation between Co-Co atoms is always greater than that of Ni-Ni, and the formation of the 142