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Nonetheless, the prevailing technologies can very quickly cause the non-uniformly fractured surface of infrared MOAs, because of the built-in low break toughness and high anisotropy of infrared products as well as the time-varying chip width induced by ever-changing level and pitch of this desired MOAs. In this study, a novel self-tuned diamond milling (STDM) system is recommended to ultimately achieve the ductile cutting of infrared MOAs with enhanced the top uniformity and machining efficiency,
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