https://www.selleckchem.com/pr....oducts/tp0427736-hcl
To perform a numerical simulation using FEM to study the von Mises stresses on Mushroom archwires. Mushroom archwires made of titanium-molybdenum alloy with 0.017 x 0.025-in cross-section were used in this study. A YS of 1240 MPa and a Young's modulus of 69 GPa were adopted. The archwire was modeled in Autodesk Inventor software and its behavior was simulated using the finite element code Ansys Workbench (Swanson Analysis Systems, Houston, Pennsylvania, USA). A large displacement simulation was used for non-linear analysis. The ar
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